Home » Thermal Management » Vertically Oriented Thermal Pads » GTU1600BN Series — Boron Nitride Thermal Conductive Gasket

GTU1600BN Series — Boron Nitride Thermal Conductive Gasket

A boron nitride filled gasket pad for bridging micro-gaps between heat-generating components and thermal dissipation structures. Electrically insulating, mechanically resilient, and available in three thickness grades to suit different interface requirements.

Specifications

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Strengths

Thermal conductivity ≥15 W/m·K — strong vertical heat transfer
Three standard grades: 0.3 mm / 0.5 mm / 0.7 mm
Breakdown voltage from 3.5 kV (0.3 mm) to 8 kV (0.7 mm)
Hardness (Shore C) 60–80 — withstands repeated compression without permanent set
UL94 V-0 rated; complies with RoHS, Halogen-Free, and REACH
Die-cut profiles available; single- or double-sided adhesive options

Customization

Reinforcement substrate: PI / fiberglass cloth / silicone cloth / PEN
Compression ratio range: 0–60% | Rebound rate range: 0–70%
Adhesive bond strength: light / firm / single-sided / double-sided
Low oil-migration and low-volatility compound variants

Technical Information

Review the key specifications, model differences, recommended applications, installation notes.

Property	GTU1600BN Series
Color	White
Thermal Conductivity	≥ 15 W/m·K
Density	1.6 ± 0.2 g/cm³
Hardness	Shore C 60 ~ 80
Volume Resistivity	≥ 1013 Ω·cm
Dielectric Constant (@1MHz)	≤ 4.2
Operating Temperature	-40 ~ 150℃
Thermal Weight Loss Rate	≤ 1
Flammability	UL94 V-0
Shelf Life	12 months

Model	Thickness	Breakdown Voltage	Thermal Resistance (@40psi)
GTU1600BN-03	0.3 mm	≥ 3.5 kV	≤ 0.4 ℃·cm²/W / ≤ 0.06 ℃·in²/W
GTU1600BN-05	0.5 mm	≥ 6 kV	≤ 0.5 ℃·cm²/W / ≤ 0.08 ℃·in²/W
GTU1600BN-07	0.7 mm	≥ 8 kV	≤ 0.65 ℃·cm²/W / ≤ 0.1 ℃·in²/W

Installation Notes

Semiconductor heat sinks and IGBT modules
Vehicle navigation and infotainment systems
Communication and power supply equipment
Graphics cards and memory module cooling
LED and lighting assemblies
LCD and plasma display back-planes

Installation Notes

Match thickness grade to the actual gap clearance and required dielectric class
Keep sealed until use — store away from heat, moisture, and open flame
Non-hazardous for transport; shelf life 12 months
Confirm die-cut fit on sample assembly before launching production

Frequently asked questions

What is the main function of GTU1600BN Series?

GTU1600BN Series is designed to fill tiny gaps between heat-generating components and heat sinks, reducing thermal resistance while providing reliable electrical insulation and resilient thermal interface support.

What thickness options are available in GTU1600BN Series?

GTU1600BN Series is available in three standard thicknesses: 0.3 mm, 0.5 mm, and 0.7 mm.

What is the difference between the three models?

The main differences are thickness, breakdown voltage, and thermal resistance. Thicker versions provide higher breakdown voltage but also slightly higher thermal resistance.

Can GTU1600BN Series be customized?

Yes. GTU1600BN Series supports customized die-cut shapes, adhesive options, reinforcement forms, compression ratio, rebound rate, and low oil leakage / low volatility performance options.

What applications is GTU1600BN Series suitable for?

It is suitable for semiconductor heat sinks, vehicle navigators, communication and power equipment, graphics cards, memory modules, lighting equipment, and LCD / plasma TV assemblies.