GTU-SCI Series — Thermal Film / Sil Pads

Thin-film thermal interface pads with PI or fiberglass substrate (Depending on the need), providing repeatable thickness control and reliable electrical isolation. Conductivity options span 0.8–5.0 W/m·K to cover a wide range of interface requirements.

Strengths

  • Multiple standard grades available depending on the Thermal Conductivity need/Insulation Requirement
  • PI-film Reinforcement and fiberglass Reinforcement available options
  • Tight dimensional control ensures consistent performance in automated builds
  • Maintains electrical isolation under repeated thermal cycling
  • PSA adhesive backing option for tool-free positioning
  • RoHS / REACH / Halogen-Free certified across the range

Customization

  • Grade selection by required conductivity level
  • Substrate choice: PI film or fiberglass (FG) per dielectric specification
  • PSA adhesive backing: single-sided or double-sided
  • Custom sheet dimensions and Cut-to-Shape Dimensions

Technical Information

Review some Applications recommendations and how to use product series. 

Installation Notes
  • Telecom and server PCB thermal layers
  • SSD thermal management films
  • Motor controller and drive heat paths
  • Optical module heat dissipation
  • Power PCB electrical insulation layers
  • Communication base station assemblies
Installation Notes
  • Peel liner and position onto a clean, dry surface
  • PI-Film and Fiberglass reinforcement hold their shape under compression — no stretching
  • Cut to size before placement; do not stretch once positioned
  • Store in original packaging, protected from dust and moisture

Related Products

A boron nitride filled gasket pad for bridging micro-gaps between heat-generating components and thermal dissipation structures.
A graphene-based thermally conductive gasket engineered for high-power electronics and precision optics.
A solid-at-room-temperature thermal film that transitions to a low-viscosity state at operating heat.
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