Home » Thermal Management » Vertically Oriented Thermal Pads » GTU-SCI Series — Thermal Film / Sil Pads
GTU-SCI Series — Thermal Film / Sil Pads
Thin-film thermal interface pads with PI or fiberglass substrate (Depending on the need), providing repeatable thickness control and reliable electrical isolation. Conductivity options span 0.8–5.0 W/m·K to cover a wide range of interface requirements.
Strengths
- Multiple standard grades available depending on the Thermal Conductivity need/Insulation Requirement
- PI-film Reinforcement and fiberglass Reinforcement available options
- Tight dimensional control ensures consistent performance in automated builds
- Maintains electrical isolation under repeated thermal cycling
- PSA adhesive backing option for tool-free positioning
- RoHS / REACH / Halogen-Free certified across the range
Customization
- Grade selection by required conductivity level
- Substrate choice: PI film or fiberglass (FG) per dielectric specification
- PSA adhesive backing: single-sided or double-sided
- Custom sheet dimensions and Cut-to-Shape Dimensions
Technical Information
Review some Applications recommendations and how to use product series.
Installation Notes
- Telecom and server PCB thermal layers
- SSD thermal management films
- Motor controller and drive heat paths
- Optical module heat dissipation
- Power PCB electrical insulation layers
- Communication base station assemblies
Installation Notes
- Peel liner and position onto a clean, dry surface
- PI-Film and Fiberglass reinforcement hold their shape under compression — no stretching
- Cut to size before placement; do not stretch once positioned
- Store in original packaging, protected from dust and moisture
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123, Zone Industrielle de l’Argile II, 06370
Mouans Sartoux, FRANCE
Tel. +33 (0)4 93 75 75 34
深圳市格瑞维克电子科技有限公司
深圳市南山区南山街道向南社区海德二道470号海德大厦A1002A
Shenzhen, CHINA