GTU-GSF75-03 — Graphene Thermal Pads
A graphene-based thermally conductive gasket engineered for high-power electronics and precision optics. Delivers extremely low interfacial resistance in a sub-millimetre profile, with low oil bleed to protect contamination-sensitive surroundings.
Strengths
- Measured thermal conductivity avg. 76.7 W/m·K (spec: ≥75 W/m·K)
- Interface resistance avg. 0.095 °C·cm²/W (spec: ≤0.10 °C·cm²/W @40 psi)
- Compression rebound ≥60% — contact maintained over extended service
- Oil bleed ≤3% — safe for optics-adjacent placements
- Density 0.6–0.9 g/cm³ — negligible weight penalty
- Thermal resistance change ≤13.7% after 1,000 h aging at 125 °C
Customization
- Adhesive: light tack / firm / single-sided / double-sided
- Custom packaging arrangement available on request
- Non-standard thickness configurations on request
Technical Information
Review the key specifications, model differences, recommended applications and installation notes.
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Property
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GTU-GSF75-03
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Color
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Black
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Thickness
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0.27–0.33 mm
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Density
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0.6–0.9 g/cm³
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Hardness
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Shore C 60 ~ 80
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Thermal Conductivity
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≥75 W/m·K
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Thermal Resistance
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@40 psi: ≤0.10 °C·cm²/W
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Oil Bleed Rate
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≤3%
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Compression Rebound
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≥60%
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Operating Temperature
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-40 ~ 150 °C
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Shelf Life
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12 months
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Model
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Thickness
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Breakdown Voltage
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Thermal Resistance (@40psi)
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|---|---|---|---|
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GTU-GSF75-03
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0.3 mm
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≥75 W/m·K
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≤0.10 °C·cm²/W
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Custom thicknesses and die-cut shapes available on request
- High-power semiconductor packages
- AI server and data-centre computing modules
- GPU and high-density memory stacks
- Precision optical transceivers and modules
- LED and display panel heat paths
- Automotive power electronics
- Apply at rated compression only — excessive pressure risks material damage
- Optics-safe: low oil bleed prevents surface contamination
- Gap must be within 0.27–0.33 mm; validate before ordering
- Store cool and dry; run assembly trial before series production
Frequently asked questions
What is the main reason to choose GTU-GSF75-03?
Is GTU-GSF75-03 suitable only for AI chips?
No. The updated datasheet also lists intelligent driving chips, optical modules, communication equipment, aerial drones, humanoid robots, and semiconductor testing among the typical applications.
What is the difference between the three models?
What storage conditions are recommended?
Store the product in a cool, dry place with storage temperature ≤30°C and storage humidity ≤75% RH.
What is the shelf life of GTU-GSF75-03??
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123, Zone Industrielle de l’Argile II, 06370
Mouans Sartoux, FRANCE
Tel. +33 (0)4 93 75 75 34
深圳市格瑞维克电子科技有限公司
深圳市南山区南山街道向南社区海德二道470号海德大厦A1002A
Shenzhen, CHINA
