GTU_30C — Phase Change Thermal Interface Material
A solid-at-room-temperature thermal film that transitions to a low-viscosity state at operating heat. Once heated, it wets the mating surfaces completely, displaces voids, and resolidifies into a stable, low-resistance bondline.
Strengths
- Thermal conductivity: 3.0 W/m·K (GTU_30C)
- Phase change at ~52 °C — wetting occurs automatically during device operation
- Solid-state handling avoids the mess and pump-out risk of liquid greases
- Achieves ultra-thin bondline once molten for minimal interface resistance
- Suited to automated assembly processes — no dispensing equipment needed
- RoHS, REACH, and Halogen-Free compliant
Customization
- Custom die-cut to IC package or module footprint dimensions
- Carrier-backed versions for automated pick-and-place lines
- Additional conductivity grades available on request
- Single-use and reworkable material constructions
Technical Information
Review the key specifications, model differences, recommended applications, installation notes.
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Property
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GTU_30C
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Model:
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GTU_30C
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Thermal Conductivity:
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3.0 W/m·K
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Phase-Change Temperature:
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~52 °C
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Operating Temperature:
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-40 ~ 125 °C
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Compliance:
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RoHS, Halogen-Free, REACH
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Model
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Thickness
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Breakdown Voltage
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|---|---|---|
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GTU_30C
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3.0 W/m·K
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~52 °C phase change
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Pre-cut to standard IHS sizes available
Additional grades on request
- CPU and GPU integrated heat spreaders
- Power transistor top-side interface
- Compact AC/DC converter modules
- LED driver circuit boards
- Memory module PCB heat paths
- RF power amplifier packages
- Place film dry-side down onto the component — do not pre-heat
- Wetting begins automatically once the device reaches operating temperature
- Reposition before first heat cycle only — irreversible after phase transition
- No squeeze-out occurs at normal bondline compression
Frequently asked questions
Is GTU_30C solid or liquid during assembly?
What thickness options are available?
Standard thickness is 0.20 mm, with custom thickness from 0.13 to 0.5 mm.
Can it be die-cut into custom shapes?
Yes, sheet size and die-cut format can be customized.
What applications is it suitable for?
It is suitable for microprocessors, servers, memory modules, ICs, LED lighting, and similar electronic interfaces.
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深圳市格瑞维克电子科技有限公司
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