Home » Thermal Management » Vertically Oriented Thermal Pads » GTU-CSF Series — Carbon Fiber Thermal Pads
GTU-CSF Series — Carbon Fiber Thermal Pads
Carbon-fibre-reinforced silicone thermal pads with anisotropic through-thickness conductivity. The soft silicone matrix compresses easily to expel trapped air and improve contact efficiency across irregular mating surfaces.
Strengths
- Grade range: 10 W/m·K (GTU-CSF10) / 15 W/m·K (GTU-CSF15) / 20 W/m·K (GTU-CSF20)
- Compressible silicone layer removes interfacial air for better effective conductivity
- Wide thickness range 0.3–12 mm; standard hardness (Shore 00) 40 or 60
- Thermal resistance at 1 mm / 20 psi: 0.28 °C·in²/W (GTU-CSF10 reference)
- UL94 V-0 across all grades; operating range -50–160 °C
- 24-month shelf life; RoHS / REACH / Halogen-Free compliant
Customization
- Thickness tolerance ±10%; hardness tolerance ±5%
- Color, thickness, and hardness adjustable per project specification
- Halogen-free and low-migration silicone compound variants
Technical Information
Review the key specifications, model differences, recommended applications, installation notes.
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Property
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GTU-CSF Series
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|---|---|
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Color
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Black
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Substrate:
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Liquid Silicone Rubber
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Filler:
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Carbon Fiber + Al₂O₃
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Thickness Range:
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0.3–12 mm
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Density (GTU-CSF10):
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2.7 ± 0.2 g/cm³
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Thermal Conductivity:
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10 / 15 / 20 W/m·K (by grade)
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Thermal Resistance (GTU-CSF10, 1mm @20 psi):
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0.28 °C·in²/W
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Optimal Compression Ratio:
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10 ± 5%
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Operating Temperature:
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-50 ~ 160 °C
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Shelf Life
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24 months
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Model
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Thickness
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Breakdown Voltage
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Thermal Resistance (@40psi)
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|---|---|---|---|
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GTU-CSF10
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10 W/m·K
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0.3–12 mm
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Shore 00: 40 / 60
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GTU-CSF15
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15 W/m·K
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0.3–12 mm
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Shore 00: 40 / 60
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GTU-CSF2010
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20 W/m·K
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0.3–12 mm
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Single-sided adhesive
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GTU-CSF20-HR
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20 W/m·K
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0.3–12 mm
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High-resilience grade
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Installation Notes
- Semiconductor and power module heat paths
- Communication base stations and power supplies
- GPU and memory module thermal layers
- LED, LCD, and display assemblies
- In-vehicle navigation and automotive ECUs
- Routers, laptops, and consumer electronics
Installation Notes
- Keep compression at 10 ±5% — over-compression degrades thermal performance
- Store in a cool, ventilated area — non-hazardous for shipping
- Test with actual stack-up before committing to production volumes
Frequently asked questions
What is the main reason to choose GTU-CSF?
The main reason is to combine 30 W/m·K thermal conductivity with low thermal resistance, soft conformable contact, and easy assembly in one carbon fiber thermal pad.
Is GTU-CSF suitable only for chip testing?
No. The updated datasheet also lists capacitors, optical modules, 5G base station radio remote units, and thermal module testing among the typical applications.
What thermal-resistance level is listed?
Store the product in a cool, dry place with storage temperature ≤30°C and storage humidity ≤75%.
What storage conditions are recommended?
Store the product in a cool, dry place with storage temperature ≤30°C and storage humidity ≤75%.
What is the shelf life of GTU-CSF?
The current datasheet lists a shelf life of 12 months under the recommended storage conditions.
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123, Zone Industrielle de l’Argile II, 06370
Mouans Sartoux, FRANCE
Tel. +33 (0)4 93 75 75 34
深圳市格瑞维克电子科技有限公司
深圳市南山区南山街道向南社区海德二道470号海德大厦A1002A
Shenzhen, CHINA