Silicone Thermal Conductive Pad
General-purpose silicone rubber thermal pads filled with ceramic thermally conductive particles. They provide a reliable, electrically insulating gap-fill interface for a broad range of electronics and power device thermal management tasks.
Strengths
- Conductivity rang can reach up to 15 W/m·K — grade chosen to match the design target
- Shore 00 Hardness – Customizable
- Provides electrical isolation between heat source and heat sink (If needed)
- RoHS / REACH / Halogen-Free across all grades
- Fiberglass or PI reinforcement layer available for higher dimensional stability (If needed)
Customization
- Conductivity and hardness grade selected per thermal model
- Thickness from 0.3 mm upward; die-cut to custom footprint
- Reinforcement substrate (fiberglass or PI) on request
- Adhesive: no adhesive / single-sided / double-sided PSA / Tackiness / Non-Tackiness
Technical Information
Review some Applications recommendations and how to use product series.
Installation Notes
- Power module to heat sink interface
- LED and solid-state lighting PCBs
- Consumer electronics mainboards
- Automotive ECU and power electronics
- Telecom and networking equipment
- Industrial drives and inverter assemblies
Installation Notes
- Apply with 20–40 psi clamping — clean mating surfaces before assembly
- Adhesive-backed grades simplify positioning and prevent pad shift
- Confirm that gap dimension matches pad thickness before ordering
- Do not stretch during placement
Related Products
Thermal interface pads based on acrylic or polyurethane matrices rather than silicone.
A graphene-based thermally conductive gasket engineered for high-power electronics and precision optics.
Thin-film thermal interface pads with PI or fiberglass substrate (Depending on the need), providing repeatable thickness control and reliable electrical isolation.
123, Zone Industrielle de l’Argile II, 06370
Mouans Sartoux, FRANCE
Tel. +33 (0)4 93 75 75 34
深圳市格瑞维克电子科技有限公司
深圳市南山区南山街道向南社区海德二道470号海德大厦A1002A
Shenzhen, CHINA
