Thermal Pads
Offered in both silicone and non-silicone chemistries, these pads conform easily under light pressure to eliminate air gaps at the interface, with the non-silicone option specifically formulated to avoid siloxane outgassing in contamination-sensitive environments. They’re commonly used for CPU/GPU gap filling, power supply modules, LED drivers, and optical or connector-sensitive electronics.
A family of single-component, silicone-based thermal gels that dispense ready-to-use with no mixing, available across a wide range of conductivity grades to fill variable, complex gaps.
Thermal interface pads based on acrylic or polyurethane matrices rather than silicone.
Other product types
Built with vertically aligned fillers, these pads conduct heat preferentially through the Z-axis rather than spreading it sideways, giving you faster, more direct heat transfer even at thin gauges. This directional performance makes them well suited to semiconductor heat sinks, power modules, 5G/telecom base stations, LED lighting, graphics cards, and automotive ADAS and sensor systems.
Dispensed as a flowable liquid before curing in place, these gap fillers, gels, greases, and potting compounds conform fully to irregular geometries and complex assemblies that solid pads simply can’t reach. This makes them ideal for battery pack potting, CPU/GPU thermal interfacing, and waterproof encapsulation of automotive and outdoor electronics.
Combining compressibility with long-term resilience, this range seals and cushions components against vibration, dust, and moisture.
123, Zone Industrielle de l’Argile II, 06370
Mouans Sartoux, FRANCE
Tel. +33 (0)4 93 75 75 34
深圳市格瑞维克电子科技有限公司
深圳市南山区南山街道向南社区海德二道470号海德大厦A1002A
Shenzhen, CHINA
