Two-Component Gap Filler 

A two-component silicone thermal gel (A+B, 1:1 by weight) that cures to a soft, pliable solid up to 8.0 W/m·K thermal conductivity. Designed for gap-fill and potting applications where the cured material must remain compliant to avoid stressing

Strengths

  • 1:1 mix ratio by weight — straightforward dispensing line setup
  • Cures to soft pliable gel — absorbs differential thermal expansion without cracking
  • Wets to metal, ceramic, and most plastic substrates
  • Cures at room temperature; 60–80 °C oven accelerates to 30 min
  • RoHS and Halogen-Free compliant

Customization

  • Conductivity grades: between 2.0 – 8.0 W/m·K post-cure
  • Packaging: 1:1 dual cartridge or separate Part A / Part B containers
  • Viscosity adjustment for different dispensing equipment
  • Pot life extension or reduction on request

Technical Information

Review the key specifications, model differences, recommended applications, installation notes.

Property
Two-Component Gap Filler 
Components
Two-part (A + B)
Mix Ratio
1:1 by weight
Cure
Room temperature or 60–80 °C
Post-Cure State
Soft pliable gel
Operating Temperature
-40 ~ +150 °C
Compliance
RoHS, Halogen-Free

Higher conductivity grades on request

Installation Notes
  • LED module potting and thermal gap-fill
  • EV battery thermal interface layer
  • Power inverter and UPS module encapsulation
  • 5G antenna module heat dissipation
  • High-power AC/DC converter assemblies
  • Industrial power electronics protection
Installation Notes
  • Mix Part A + Part B at 1:1 weight ratio for at least 3 minutes
  • Degas mixed material under vacuum for void-free potting
  • Dispense or pour into cavity; cure at room temp (24 h) or 60–80 °C (30 min)
  • Cure is irreversible — confirm component placement before dispensing

Frequently asked questions

What is the main function of Two-Component Gap Filler?
Two-Component Gap Filler is designed to fill small gaps between heat-generating components and heat sinks or housings, reducing interfacial thermal resistance while providing reliable electrical insulation and post-cure elastomeric shock absorption.

The recommended mix ratio is 1:1 for Component A and Component B.

Two-Component Gap Filler has a tack-free time of at least 60 minutes at 25℃, a full cure time of at least 2 hours at 25℃, and can be fully cured in at least 10 minutes at 100℃.
Two-Component Gap Filler is available in 50ml A/B cartridges, 400ml A/B cartridges, and 20KG drum packaging.

Related Products

A family of single-component, silicone-based thermal gels that dispense ready-to-use with no mixing, available across a wide range of conductivity grades to fill variable, complex gaps.
A high-purity silicone carrier loaded with thermally conductive inorganic fillers.
A two-component, silicone-based potting compound that seals electronic assemblies while conducting heat away from enclosed components, combining moisture, dust, and vibration protection with thermal management.
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