Thermally Conductive Potting Compound
A two-component, silicone-based potting compound that seals electronic assemblies while conducting heat away from enclosed components, combining moisture, dust, and vibration protection with thermal management.
Strengths
- Thermal conductivity 1.0–3.0 W/m·K — dissipates heat from potted components
- Bonds to PCB substrates, metal housings, ceramic parts, and most plastics
- Cured material provides full electrical insulation — protects from moisture and condensation
- Low shrinkage during cure — components remain in their dispensed positions
- Service range -40 ~ +150 °C; UL94 V-0 rated grades available
- RoHS compliant; flame-rated grades available for safety-critical assemblies
Customization
- Conductivity grade: 1.0–1.5 W/m·K (standard) or 2.0–3.0 W/m·K (power electronics)
- Flame rating: standard or UL94 V-0 compound
- Viscosity: pourable for gravity-fill or higher-viscosity for dispensing
- Cure speed: room-temperature slow-cure or 60 °C oven fast-cure
Technical Information
Review the key specifications, model differences, recommended applications, installation notes.
|
Property
|
Thermally Conductive Potting Compound
|
|---|---|
|
Thermal Conductivity:
|
1.0–3.0 W/m·K
|
|
Post-Cure State:
|
Semi-rigid to rigid
|
|
Adhesion Surfaces:
|
PCB, metal, plastic, ceramic
|
|
Electrical Insulation:
|
Excellent after cure
|
|
Shrinkage:
|
Low
|
|
Operating Temperature:
|
-40 ~ +150 °C
|
|
Compliance:
|
RoHS; UL94 V-0 grades available
|
|
Thermally Conductive Potting Compound
|
Values
|
Usage
|
|---|---|---|
|
Standard grade
|
1.0–1.5 W/m·K
|
General electronics potting
|
|
High-conductivity
|
2.0–3.0 W/m·K
|
Power electronics
|
|
Flame-rated grade
|
UL94 V-0 compound
|
|
|
Fast-cure grade
|
60 °C oven, 30–60 min
|
|
Installation Notes
- AC/DC power supply and inverter module potting
- Outdoor LED driver unit encapsulation
- Automotive ECU and telematics module sealing
- EV battery BMS protection and thermal bonding
- Military-grade and industrial electronics
- Outdoor telecom unit waterproofing
Installation Notes
- Degas under vacuum to eliminate air inclusions before pouring
- Fill cavity to the specified level; cure per schedule — do not disturb during cure
- Cure is irreversible — position all components correctly before potting starts; wear PPE during mixing
Related Products
A two-component silicone thermal gel (A+B, 1:1 by weight) that cures to a soft, pliable solid up to 8.0 W/m·K thermal conductivity. Designed for gap-fill and potting applications where the cured material must remain compliant to avoid stressing.
A family of single-component, silicone-based thermal gels that dispense ready-to-use with no mixing, available across a wide range of conductivity grades to fill variable, complex gaps.
A high-purity silicone carrier loaded with thermally conductive inorganic fillers.
123, Zone Industrielle de l’Argile II, 06370
Mouans Sartoux, FRANCE
Tel. +33 (0)4 93 75 75 34
深圳市格瑞维克电子科技有限公司
深圳市南山区南山街道向南社区海德二道470号海德大厦A1002A
Shenzhen, CHINA
