Thermal Conductive Silicone Grease
A high-purity silicone carrier loaded with thermally conductive inorganic fillers. It delivers low interface resistance at thin bondlines, wets both metallic and ceramic surfaces completely, and remains workable for rework — making it well suited to field-serviceable assemblies.
Strengths
- Conductivity range 1.0–8.0+ W/m·K — grade matched to thermal model requirement
- No cure cycle — assembly can proceed immediately after dispensing
- Outstanding wetting on aluminium, copper, ceramic, and composite surfaces
- Very low thermal resistance achievable at 0.05–0.10 mm bondline thickness
- Service range -50 ~ +200 °C; fully re-workable without substrate damage
- Halogen-free grades and low-siloxane-volatility formulations available
Customization
- Conductivity grade: standard (1.0–3.0 W/m·K) or high-performance (4.0–8.0+ W/m·K)
- Viscosity (spreading consistency) tuned to dispensing process
- Low-siloxane and halogen-free formulations on request
- Packaging: syringe / tube / bulk drum
Technical Information
Review the key specifications, model differences, recommended applications, installation notes.
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Property
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Thermal Conductive Silicone Grease
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Form:
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Grease / paste
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Conductivity Range:
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1.0–8.0+ W/m·K
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Cure:
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None required
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Cure:
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None required — ready to use
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Recommended Bondline:
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0.05–0.10 mm
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Operating Temperature:
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-50 ~ +200 °C
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Reworkable:
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Yes
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Compliance:
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RoHS, Halogen-Free
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Thermal Conductive Silicone Grease
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Values
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Usage
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Standard grade
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1.0–3.0 W/m·K
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General use
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High-performance
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4.0–8.0+ W/m·K
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Demanding interfaces
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Halogen-free and low-volatile-siloxane grades available
Installation Notes
- CPU and GPU processor-to-heat-sink application
- Power transistor and IGBT interface layers
- Transformer and relay cooling
- Field-maintainable and field-reworkable assemblies
- Industrial variable-speed drive thermal management
- RF power amplifiers in broadcast and telecoms
Installation Notes
- Spread a uniform thin layer — 0.05–0.10 mm is the target bondline
- Excess can be wiped away cleanly with isopropyl alcohol
- Re-work: separate surfaces, clean off old grease, reapply fresh material
- Reapply after any maintenance opening that breaks the original bondline
Related Products
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A two-component silicone thermal gel (A+B, 1:1 by weight) that cures to a soft, pliable solid up to 8.0 W/m·K thermal conductivity. Designed for gap-fill and potting applications where the cured material must remain compliant to avoid stressing.
123, Zone Industrielle de l’Argile II, 06370
Mouans Sartoux, FRANCE
Tel. +33 (0)4 93 75 75 34
深圳市格瑞维克电子科技有限公司
深圳市南山区南山街道向南社区海德二道470号海德大厦A1002A
Shenzhen, CHINA
