Single-Component Thermal Conductive Gel 

A family of single-component, silicone-based thermal gels that dispense ready-to-use with no mixing, available across a wide range of conductivity grades to fill variable, complex gaps.

Strengths

  • Silicone-free formula — no siloxane volatiles or surface migration
  • Single-component: no mixing, no pot-life, no waste from unused mixed material
  • A family of single-component, silicone-based thermal gels that dispense ready-to-use with no mixing, available across a wide range of conductivity grades to fill variable, complex gaps /  1.0–3.0 W/m·K with precise thickness control
  • High compressibility and wet-out for efficient interfacial contact
  • High electrical insulation and UL94 V-0 flame rating across the product family
  • No cracking or dripping across a wide operating temperature range

Customization

  • Conductivity grade selected to match thermal load and gap requirement
  • Viscosity adjustment matched to dispensing equipment specs
  • Packaging: syringe / cartridge / bulk drum
  • Custom conductivity target formulations on request

Technical Information

Review the key specifications, model differences, recommended applications, installation notes.

Property
Single-Component Thermal Conductive Gel 
Form:
Single-component thermal gel / putty
Base:
Silicone resin
Thermal Conductivity:
Wide range of grades available (grade dependent)
Cure:
None required — ready to use
Dielectric Strength:
Up to 8 kV/mm
Flammability:
UL94 V-0
Compliance:
RoHS, Halogen-Free
  • Available in multiple thermal conductivity grades to suit different gap and power needs
  • Grade selected by required conductivity, not from a fixed part list
  • Applications engineering matches the grade to your thermal budget
  • Custom grades on request
Installation Notes
  • CPU, GPU, and high-power processor heat sink interfaces
  • LED and lighting module thermal management
  • Automotive electronics and control unit assemblies
  • Telecom and networking equipment cooling
  • Consumer electronics with large or variable gap tolerances
  • Industrial power control and drive assemblies
Installation Notes
  • Dispense directly from syringe or cartridge — no mixing or pot-life limits
  • Apply by hand for prototypes or automated dispensing for volume production
  • Good thixotropy keeps material in place after dispensing, without sagging
  • No cure step required — components can be closed and put into service immediately

Frequently asked questions

What is the main function of Single-Component Thermal Conductive Gel?
Single-Component Thermal Conductive Gel is designed to fill gaps between heat-generating components and heat sinks or housings, reducing interfacial thermal resistance while maintaining tight contact and reliable heat dissipation.
Single-Component Thermal Conductive Gel provides a higher thermal conductivity grade at 3.0 ± 0.3 W/m·K while maintaining good flexibility, high filling rate, and stable dispensing characteristics for large gap tolerance applications.

Single-Component Thermal Conductive Gel can be applied manually or with dispensing equipment, depending on the assembly process and production requirements.

Single-Component Thermal Conductive Gel is suitable for hard disks, mobile phones, optical precision equipment, laptops, mobile and communication equipment, automobile engine control equipment, industrial control electronics, and medical electronics.

Single-Component Thermal Conductive Gel is available in 30CC / 300CC dispensing syringes and drum packaging of 5KG, 10KG, and 20KG.

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