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Across renewable energy systems, battery energy storage, EV charging infrastructure, and industrial power electronics, Gravic Group’s thermal management solutions help transfer heat away from power semiconductors, batteries, and high-power components.

Using thermal pads, gels, greases, potting compounds, and insulating materials, these solutions improve efficiency, enhance system reliability, and support long-term performance in demanding energy applications.

String Inverter with TIM and Aluminum Heat Sink

Solar string inverters rely on high-power MOSFETs and IGBTs to efficiently convert DC energy from photovoltaic panels into AC power for the grid. Thermal Interface Materials (TIMs) are used between the power semiconductor modules and the aluminum heat sink to reduce thermal resistance and improve heat transfer. This helps maintain operating efficiency, prevent hotspots, enhance system reliability, and support long-term performance in demanding outdoor renewable energy environments.

Wind Turbine Converter Module with TIM

Wind turbine full-power converter modules operate in challenging nacelle environments where continuous thermal cycling, vibration, and fluctuating power loads can impact system reliability. Thermal Interface Materials (TIMs) are used between power semiconductor modules and cooling structures to improve heat transfer and reduce thermal resistance. This helps prevent hotspots, enhance converter efficiency, and ensure long-term performance and durability in demanding renewable energy applications.

Battery Energy Storage System (BESS) with Phase-Change TIM

Battery Energy Storage Systems (BESS) require effective thermal management to maintain cell performance, safety, and lifespan. Phase-change Thermal Interface Materials (TIMs) positioned between prismatic battery cells and cooling plates help improve heat transfer while accommodating dimensional variations within the cell stack. This enables more uniform temperature distribution, reduces thermal hotspots, enhances battery efficiency, and supports long-term reliability in demanding energy storage applications.

DC Fast Charger Power Module with TIM

DC fast charging systems use high-power SiC (silicone carbide) switching devices to deliver rapid and efficient energy transfer to electric vehicles. Thermal Interface Materials (TIMs) are positioned between the SiC power modules and cooling structures to minimize thermal resistance and maximize heat dissipation. This helps maintain charging efficiency, reduce device temperatures, improve system reliability, and support continuous operation under the high-power demands of modern EV charging infrastructure.

Variable Frequency Drive (VFD) with TIM Under Power Module

Variable Frequency Drives (VFDs) use high-power semiconductor modules to control motor speed and optimize energy efficiency in industrial systems. Thermal Interface Materials (TIMs) are placed between the power module and the cooling structure to minimize thermal resistance and improve heat transfer. This helps reduce operating temperatures, prevent hotspots, enhance system reliability, and ensure consistent performance in demanding industrial environments with continuous operation and varying load conditions.

Related Products

Vertically Oriented Thermal Pads

Built with vertically aligned fillers, these pads conduct heat preferentially through the Z-axis rather than spreading it sideways, giving you faster, more direct heat transfer even at thin gauges. This directional performance makes them well suited to semiconductor heat sinks, power modules, 5G/telecom base stations, LED lighting, graphics cards, and automotive ADAS and sensor systems.

Liquid Solutions

Dispensed as a flowable liquid before curing in place, these gap fillers, gels, greases, and potting compounds conform fully to irregular geometries and complex assemblies that solid pads simply can’t reach. This makes them ideal for battery pack potting, CPU/GPU thermal interfacing, and waterproof encapsulation of automotive and outdoor electronics.

Thermal Pads

Offered in both silicone and non-silicone chemistries, these pads conform easily under light pressure to eliminate air gaps at the interface, with the non-silicone option specifically formulated to avoid siloxane outgassing in contamination-sensitive environments. They’re commonly used for CPU/GPU gap filling, power supply modules, LED drivers, and optical or connector-sensitive electronics.