Electronics

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Modern electronic devices rely on effective thermal management to maintain performance, reliability, and longevity. Gravic Group provides advanced thermal solutions—including thermal pads, gels, greases, phase change materials, and gap fillers—for consumer electronics, semiconductors and processors, industrial electronics, and medical devices. These materials efficiently transfer heat away from high-power components, helping systems operate cooler, more stable, and more reliably in demanding applications.

Laptop SoC with Thermal Pad and Heat Spreader

Modern laptops rely on efficient thermal management to maintain performance and prevent overheating. A thermal pad positioned between the System-on-Chip (SoC) and the heat spreader fills microscopic air gaps and creates an efficient thermal path for heat transfer. This helps distribute heat more evenly, reduce hotspots, improve system stability, and support sustained performance during demanding workloads.

CPU/GPU Lid-to-IHS Interface with TIM Layers

High-performance CPUs and GPUs generate significant heat that must be efficiently transferred away from the silicone die to maintain performance and reliability. Thermal Interface Materials (TIM1 and TIM2) are used between the die, lid, and Integrated Heat Spreader (IHS) to minimize thermal resistance and improve heat transfer. By filling microscopic surface imperfections, these TIM layers help reduce hotspots, enhance thermal efficiency, and support sustained operation in demanding computing, AI, and graphics applications.

Motor Drive Inverter with TIM and Water-Cooled Baseplate

Motor drive inverters rely on high-power IGBT modules that generate substantial heat during operation. A Thermal Interface Material (TIM) positioned between the IGBT module and the water-cooled baseplate minimizes thermal resistance and ensures efficient heat transfer to the cooling system. This improves thermal performance, reduces hotspots, enhances power module reliability, and supports long-term operation in demanding industrial, transportation, and energy applications.

Medical Device Electronics with TIM for High-Power Drivers

Advanced medical devices such as MRI gradient amplifiers and portable ultrasound systems rely on high-power electronic components that generate significant heat during operation. Thermal Interface Materials (TIMs) are used between power drivers and heat spreaders or cooling structures to improve heat transfer and reduce thermal resistance. This helps maintain imaging accuracy, enhance device reliability, and ensure stable performance in critical healthcare applications where precision and continuous operation are essential.

Related Products

Silicone Foam & Elastomers

Combining compressibility with long-term resilience, this range seals and cushions components against vibration, dust, and moisture.

Thermal Pads

Offered in both silicone and non-silicone chemistries, these pads conform easily under light pressure to eliminate air gaps at the interface, with the non-silicone option specifically formulated to avoid siloxane outgassing in contamination-sensitive environments. They’re commonly used for CPU/GPU gap filling, power supply modules, LED drivers, and optical or connector-sensitive electronics.

Liquid Solutions

Dispensed as a flowable liquid before curing in place, these gap fillers, gels, greases, and potting compounds conform fully to irregular geometries and complex assemblies that solid pads simply can’t reach. This makes them ideal for battery pack potting, CPU/GPU thermal interfacing, and waterproof encapsulation of automotive and outdoor electronics.