Communication & Data Infrastructure

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In communication and AI infrastructure, Gravic Group provides advanced thermal management and functional material solutions that help cool high-power components and protect critical assemblies in 5G base stations, optical modules, data centers, and AI servers.

By reducing hotspots and improving heat dissipation, Gravic Group’s solutions enhance reliability, support stable signal integrity, and ensure consistent system performance in demanding operating environments.

Massive MIMO Antenna Module with TIM and Heat Spreader

Massive MIMO antenna systems used in 5G infrastructure contain multiple high-power amplifier (PA) chips that generate significant heat during continuous operation. Thermal Interface Materials (TIMs) are placed between the PA chips and the heat spreader to minimize thermal resistance and improve heat transfer efficiency. This enables better thermal performance, reduces hotspots, enhances signal stability, and supports the long-term reliability required for high-density telecommunications equipment operating in demanding outdoor environments.

Server Blade with TIM and Liquid Cooling

Modern data center servers rely on high-performance CPUs and GPUs that generate substantial heat during AI, cloud computing, and data processing workloads. Thermal Interface Materials (TIMs) are used between the processors and cold plates within liquid cooling systems to minimize thermal resistance and maximize heat transfer efficiency. This helps maintain optimal operating temperatures, improve energy efficiency, support higher computing densities, and ensure reliable performance in mission-critical data center environments.

High-Speed Switch ASIC with Thermal Pad and Chassis Heat Spreader

High-speed networking equipment relies on powerful switch ASICs that generate significant heat while processing large volumes of data. Thermal pads are used between the ASIC and the chassis heat spreader to create an efficient thermal path and reduce thermal resistance. This helps improve heat dissipation, maintain signal integrity, enhance system reliability, and support continuous operation in demanding networking and data communication environments.

Related Products

Vertically Oriented Thermal Pads

Built with vertically aligned fillers, these pads conduct heat preferentially through the Z-axis rather than spreading it sideways, giving you faster, more direct heat transfer even at thin gauges. This directional performance makes them well suited to semiconductor heat sinks, power modules, 5G/telecom base stations, LED lighting, graphics cards, and automotive ADAS and sensor systems.

Liquid Solutions

Dispensed as a flowable liquid before curing in place, these gap fillers, gels, greases, and potting compounds conform fully to irregular geometries and complex assemblies that solid pads simply can’t reach. This makes them ideal for battery pack potting, CPU/GPU thermal interfacing, and waterproof encapsulation of automotive and outdoor electronics.

Thermal Pads

Offered in both silicone and non-silicone chemistries, these pads conform easily under light pressure to eliminate air gaps at the interface, with the non-silicone option specifically formulated to avoid siloxane outgassing in contamination-sensitive environments. They’re commonly used for CPU/GPU gap filling, power supply modules, LED drivers, and optical or connector-sensitive electronics.